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  • Slice Thickness
    160um reduced to 130um
    (mass production)
  • Line Diameter
    40um reduced to 34um
    (mass production)
  • PV Wafer Size
  • Process Time
    Shortened to 90 min
  • Leading in Industry
    Significant improvement in yield,
    output and decrease in cost
  • Industrial Union
    To advance the "large size and thin thickness" process of PV wafer